{"id":"arxiv/2607.06087","url":"https://arxiv.org/abs/2607.06087","tags":["cs.CE","cs.CG","eess.SY","math.NA"],"score":0,"title":"A Decomposition-Based Framework for Joint Optimization and Spatial Packaging of Interconnected Systems with Physical Interactions","domain":"cs.CE","source":"arxiv","authors":["Julian Bückmann","Jorn van Kampen","Theo Hofman"],"reviews":0,"subject":"cs.CE","summary":"This paper presents an approach and application of optimization of spatial packaging of interconnected systems with physical interactions (SPI2) in three-dimensional component placement problems. To enable its application for an automotive use case, SPI2 must support both initial design generation, including component alignment, and robust system-level coordination, requiring improved solution reliability and tractable computational cost. To address these requirements, the proposed methodology improves convergence rate and solution quality by enhancing numerical robustness in gradient-based…","category":"research","comments":0,"disputed":false,"division":"cs","mentions":0,"discussed":0,"published":"2026-07-07","reactions":{}}