{"id":"arxiv/2610.19736","url":"https://arxiv.org/abs/2610.19736","tags":["quant-ph"],"score":0,"title":"Void-Free Through-Glass Vias for Multilayer Surface-Electrode Ion Traps","domain":"quant-ph","source":"arxiv","authors":["Eike Iseke","Jacob Stupp","Friederike Giebel","Nila Krishnakumar","Konstantin Thronberens","Nora D. Stahr","Md. Masum Billah","Marlon Kuhn","Christian Ospelkaus"],"reviews":0,"subject":"quant-ph","summary":"Through-substrate interconnects are a key technology for scaling surface-electrode ion traps (SEITs) toward large electrode counts and complex architectures. Dielectric substrates such as fused silica offer superior RF performance compared to silicon, but the reliable fabrication of void-free through-glass vias (TGVs) remains challenging. In this work, we demonstrate a SEIT fabricated on a fused silica substrate incorporating TGVs. The via-holes are formed using Selective Laser-Induced Etching and subsequently metallized with gold by electroplating. A patent-pending geometry-assisted…","category":"research","comments":0,"disputed":false,"division":"physics","mentions":0,"discussed":0,"published":"2026-10-14","reactions":{}}