Accurate gap control of 3D-integrated superconducting quantum circuits using asymmetric indium architecture and multi-angle flip-chip bonding

L. Richard, N. Bruckmoser, J. Feigl, D. Bunch, A. Bhattacharjee, L. Koch, I. Tsitsilin, V. P. Bader, H. Hu, L. Södergren, S. Filipp

arXivarxiv/2610.21435Oct 15, 2026quant-phscore 0

Flip-chip 3D integration is a key enabling technology for overcoming the routing and layout constraints of planar superconducting quantum processors, but it requires accurate and uniform control of the inter-chip spacing while preserving qubit coherence. In conventional processes, thick indium bumps are deposited symmetrically on both chips, while dedicated spacers are introduced to limit the residual tilt. Here, we present a flip-chip bonding process based on an asymmetric indium architecture, combining $20\,μ\mathrm{m}$ thick indium bumps on the control chip with $200\,\mathrm{nm}$ thin…

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