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A Decomposition-Based Framework for Joint Optimization and Spatial Packaging of Interconnected Systems with Physical Interactions

Julian Bückmann, Jorn van Kampen, Theo Hofman

arXivarxiv/2607.06087Jul 7, 2026cs.CEscore 0

This paper presents an approach and application of optimization of spatial packaging of interconnected systems with physical interactions (SPI2) in three-dimensional component placement problems. To enable its application for an automotive use case, SPI2 must support both initial design generation, including component alignment, and robust system-level coordination, requiring improved solution reliability and tractable computational cost. To address these requirements, the proposed methodology improves convergence rate and solution quality by enhancing numerical robustness in gradient-based…

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